multilayer ceramic chip capacitors 1 of 3 creation date : june 28, 2017 (gmt) cga4j1x7r0j685m125ac tdk item description cga4j1x7r0j685mt**** applications automotive grade feature general general (up to 50v) aec-q200 aec-q200 series cga4(2012) [eia 0805] status production size length(l) 2.00mm 0.20mm width(w) 1.25mm 0.20mm thickness(t) 1.25mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 6.8f 20% rated voltage 6.3vdc temperature characteristic x7r(15%) dissipation factor (max.) 10% insulation resistance (min.) 14m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : june 28, 2017 (gmt) cga4j1x7r0j685m125ac characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cga4j1x7r0j685m125ac esr cga4j1x7r0j685m125ac capacitance cga4j1x7r0j685m125ac dc bias characteristic cga4j1x7r0j685m125ac temperature characteristic cga4j1x7r0j685m125ac(no bias) cga4j1x7r0j685m125ac(dc bias = 3.15v ) ripple temperature rising cga4j1x7r0j685m125ac(100khz) cga4j1x7r0j685m125ac(500khz) cga4j1x7r0j685m125ac(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : june 28, 2017 (gmt) cga4j1x7r0j685m125ac associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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